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Semiconductor Equipment Components

  • Industry Context & Processing Challenges: Wafer processing vacuum chambers, susceptors, and gas distribution plates utilize high-purity 316L stainless steel, quartz, or ceramics (Alumina/SiC). Machining demands ultra-high surface smoothness, absolute cleanliness, and zero contamination or micro-cracking.
  • Technical Requirements: Vacuum seal face roughness Ra≤0.2 μm, and zero micro-chipping on ceramic/quartz hole edges.
  • ZWH Tooling Solutions & Value: ZWH supplies CVD diamond-coated carbide tools and high-density micro-grain carbide reamers. These tools resist abrasive wear on ceramic substrates and maintain clean cutting edges, meeting Ultra-High Vacuum (UHV) sealing standards.